Mask Aligner

Instrument Specification

The MA6 mask aligner was designed to pattern parts of thin films using optical lithography. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate. 

The Karl Suss MA6 is one of the most reliable mask aligners in the industry with a minimal maintenance cost. It works with substrates up to 150mm in diameter. The exposure wavelength is UV400 (range 350- 450 nm). Two exposure intensity channels are supplied over which the user can vary the exposure time for proper image sharpness. 

A Bottom Side Alignment option allows patterning on both sides of the substrate. 

Automatic wedge compensation can be used to ensure that the mask and the wafer are parallel. Z-axis is motorized, and the gap between mask and wafer is programmable from 0 to 300 microns. 

Several contact modes are available, for which the space resolution is as following:

Contact mode Space Resolution
Vacuum Contact < 0.8  μm
Hard Contact 1.0  μm
Soft Contact 2.0  μm
Proximity 2.5  μm

 

 

 

 

 

 

 

 

Training information

  • 2-4 hours training, depends on customer needs. 
  • No Prerequisites. Verbal explanation & SOP on MA6 operation principles: safety, turn on/off, microscope operation, operator menu, front side / back side alignment. Trainee’s hands-on under my supervision. 

Location

Perlman building –1 floor, room 15 (Yellow room)

Staff Contacts

Training information

2-4 hours of training (depends on customer needs)
No Prerequisites.
Verbal explanation accompanied with SOP manual on MA6 operation principles:

  • Safety
  • Turn on/off
  • Microscope operation
  • Operator menu
  • Front side/back side alignment. 
  • Trainee's hands-on under a tool owner's supervision.

Links & Documents