RAITH E_Line Plus Electron Beam Lithography and Nano-engineering workstation, Electron Beam Lithography (EBL) is one of the most common techniques for fabricating micro or nanostructures on surfaces. EBL has gained importance over other lithographic techniques because its…

AFM/SPM Dimension Edge

Inspection & Metrology

AFM/SPM Dimension Edge

The Dimension Edge Atomic Force Microscope

This technology provides the highest levels of performance, functionality, and accessibility in its class.

Based on the Dimension Icon® platform, the Edge system has been designed from top to bottom to deliver the low drift and

low…

AJA Sputter ATC-1800

Additive processes

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AJA Sputter ATC-1800

The Sputtering system creates thin film layers of varied materials by a physical vapor deposition (PVD) method. Sputtering is a mechanism by which atoms are dislodged from the surface of a material because of collision with high-energy particles. Thus, Sputtering is a physical…

ALD- Fiji™ Plasma Atomic layer deposition system

Additive processes

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ALD- Fiji™ Plasma Atomic layer deposition system

Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process. ALD film growth is self-limited and based on surface reactions, which makes achieving atomic scale deposition control possible.

Most ALD reactions…

Angstrom Evaporator

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Angstrom Evaporator

The Angstrom is an E-Beam and thermal evaporator based on an Angstrom Engineering EvoVac PVD platform.

An evaporator is an instrument that produces thin film coatings of varied materials by heating the material till its starts to evaporate (transforms to its gas faze) by…

Chemical Workstations

Chemical works

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Chemical Workstations

Our laboratory has three chemical hoods, each dedicated to a different process: Solvent, lithography, and acids.

In the hoods are hotplates, spinners, ultrasonic baths, nitrogen, D.I. water guns, and a cold development station for PMMA.

Ellipsometer

Inspection & Metrology

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Ellipsometer

Ellipsometry is an optical technique for investigating the dielectric properties (complex refractive index or dielectric function) of thin films. Ellipsometry measures the change of polarization upon reflection or transmission and compares it to a model.

The ellipsometer…

Mask Aligner

Patterning

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Mask Aligner

The MA6 mask aligner was designed to pattern parts of thin films using optical lithography. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate.

The Karl Suss MA6 is one of the most…

Microfluidics workstation

Microfluidics

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Microfluidics workstation

Microfluidics is both the science that studies the behavior of fluids through microchannels and the technology of manufacturing microminiaturized devices containing chambers and tunnels through which fluids flow or are confined.

Due to its use in a wide range of disciplines…

MicroWriter ML®3

Patterning

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MicroWriter ML®3

Manufacturer: Durham Magneto Optics Ltd

MicroWriter ML®3 is a high-performance, direct-write optical lithography machine. for direct writing applications and low volume mask making. Easy to use Windows® based software means most exposures can be set up and launched with just…

Odem Evaporator

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Odem Evaporator

The Odem- High throughput KW E.B.Gun system is designed for electron beam and thermal deposition produced by Odem Scientific Applications Ltd.

Electron Beam Evaporation is a form of physical vapor deposition in which an electron beam bombards the target material causing local…

Olympus BX51 optical microscope

Inspection & Metrology

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Olympus BX51 optical microscope

Magnification: x5, x10, x20, x50, x100, x250

Top and bottom light sourcing

A high-quality darkfield effect at all magnifications.

Hand X&Y maneuvered stage with a rubber knob.

DIC observation system.

Yellow filter for the light source.

A trinocular tube with a high…

Optical stereo microscope Olympus SZX16

Inspection & Metrology

Optical stereo microscope Olympus SZX16

Magnification range X5.6-X92. (SDFPLAPO0.8X)
Working distance 81 mm.
LED controllable integrated light ring.
Trinocular tube with attached Motic digital module for imaging and image storage on a shared drive.

PECVD-Plasma-Therm Plasma Enhanced Chemical Vapor Deposition

Additive processes

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PECVD-Plasma-Therm Plasma Enhanced Chemical Vapor Deposition

Plasma-enhanced chemical vapor deposition (PECVD) is a process used to deposit SiO2, Si3N4, or SiOxNy dielectric films.

A plasma of reacting gases is created by R.F. (A.C.) frequency leading to chemical reactions in the chamber. Energy for chemical reactions is provided…

Plasma Asher

Etching processes

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Plasma Asher

This is a compact plasma treatment bench-top configuration system designed for a wide variety of plasma cleaning, surface activation and adhesion improvement applications.

A system chassis houses the plasma chamber, control electronics, 13.56 MHz RF generator, and the…

Profilometer

Inspection & Metrology

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Profilometer

Profilometry allows users to obtain a 2D trace of topographic features on a surface.

The Profilometer is most frequently used to determine the film thickness, the channel depth of microfluidic devices, and the roughness of treated surfaces.

The instrument has a vertical…

PT ICP – Plasma Therm ICP PTI-SHUTTLELOCK

Etching processes

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PT ICP – Plasma Therm ICP PTI-SHUTTLELOCK

Inductively Coupled Plasma (ICP) refers to a system configuration where plasma is generated using inductively coupling RF power in the source while independently controlling the ion energy bombarding the substrate via the applied bias power.

Features

Plasma generation is…

RTP

Thermal

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RTP

Rapid Thermal Processing [RTP] is an advanced wafer processing technology used to expose wafers to heat over a short period of time. The term RTP applies to equipment that processes wafers at high throughput due to the ability to ramp temperature up and down in a matter of…

Scriber

Packaging and assembly

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Scriber

A wafer scriber is a tool used in the semiconductor industry for the purpose of cutting or scribing wafers.

The wafers are thin, circular pieces of semiconductor material, typically made from silicon, used as a substrate for fabricating integrated circuits and other electronic…

SEM (Scanning Electron Microscope) JSM-7000F

Inspection & Metrology

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SEM (Scanning Electron Microscope) JSM-7000F

Manufacturer: Jeol

The JEOL JSM-7000F Scanning Electron Microscope was stationed in the cleanroom to help users analyze their samples while keeping them in a clean environment. The JEOL JSM-7000F, equipped with a Schottky Field Emission Gun (FEG) filament, offers high…

SPTS ICP - Omega LPX Rapier Etch System

Etching processes

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SPTS ICP - Omega LPX Rapier Etch System

The Inductively Coupled Plasma (ICP) etcher provides high chemical sensitivities with high etch rate. This SPTS ICP System uses fluorine-based gases for anisotropic deep silicon trench. The 13.56 MHz RF system produces a high-density, low- pressure, low-energy inductively coupled…

Wirebonder

Packaging and assembly

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Wirebonder

Wire bonding is a method of interconnecting between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can connect an IC to other electronics or connect from one printed circuit…

Zeta Optical Profiler

Inspection & Metrology

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Zeta Optical Profiler

The Zeta™-300 is a fully integrated optical non-contact profiling microscope that provides 3D metrology and imaging capability in a compact, robust package. The system is powered by ZDot™ technology, which simultaneously collects high-resolution 3D data and a True Color infinite…