Additive processes

Method Specification

As a necessary step in the nanofabrication of useful structures, layers of various materials are frequently deposited onto substrates. The substrate used in additive processes may or may not have previously formed material layers or patterned structures on its surface. Typically, the newly added layer is a thin film, with a thickness of one micron or less.

Many crucial film properties, including composition, thickness, uniformity, stress, density, and others, can be precisely controlled by additive processes. 

Most materials used in nanofabrication can be formed into thin films at the Weizmann Nanofab. 

Chemical vapor deposition, sputter deposition, and evaporation are the three primary techniques used in additive processes.